รูปภาพสินค้า รหัส9780442015053
9780442015053
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ผู้เขียนD.R.Frear and [et.al]

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รหัสสินค้า: 9780442015053
จำนวน: 418 หน้า
ขนาดรูปเล่ม: 158 x 235 x 27 มม.
น้ำหนัก: 775 กรัม
เนื้อในพิมพ์: ขาวดำ 
ชนิดปก: ปกแข็ง 
ชนิดกระดาษ: -ไม่ระบุ 
หน่วย: เล่ม 
สำนักพิมพ์: Thomson Learning 
:: เนื้อหาโดยสังเขป
THE MECHANICS OF SOLDER ALLOY INTERCONNECTS
By Darrel R.Frear,steven N. Burchett, Harold S. Morgan, and John H. Lau

As the trend toward the increased miniaturization of devices continues, solder interconnects are becoming the limiting factor in the reliability of electronic packages. With the critical nature of these small electrical-mechanical interconnection, the question arises: Just how reliable are the soder joints in a modren electronic package? The machanics issues associated with solder joints in this state-of-the-art assessment.

The reader will learn:
- The basic metallurgy of solder alloys
-The constitutive models available for modeling solder interconnects
- Computational simulations to predict solder joint geometry
- The application of mechanics models to throygh-hole and surface mount technologies
The Mechanics of Solder Alloy Interconnects is resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a " stand-alonea" resource for a particular aspect of materials and modeling issues. With this gained under-standing, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modilng communities to go for the appropriate answer.
:: สารบัญ
1. Introduction
2. Microstructural Influences on the Mechanical Properties of Solder
3. Interfaces and Intermetallics
4. Constitutive Models
5. Prediction of Solder Joint Geometry
6. Life Prediction and Accelerated Testing
7. Thermomechanical Modeling of Solder Joints---Numerical Considerations
8. Applications---Through-Hole
9. Surface Mount Solder Joints under Thermal,Mechanical,and Vibration Conditions