Handbook of Fine Pitch Surface Mount Technology [FPT] is a ''onestop'' guide to the state of the art of FPT. For professionals active in FPT research and devenlopment, those who wish to master FPT problem-solving methods, and those who must choose a high-yield and cost-effective manufacturing process for their interconnect systems, here is a timely summary of progress in all aspects of this fascinating field.
The topics covered include:
- fine pitch surface mount packages and their solderability characteristics - printed circuit board materials and designs - solder paste and printing technology - pick and place - solder volume estimation - vapor phase - convection/IR - forced convection with nitrogen - pulsed thermode hotbar solder reflow methods - non-CFC [aqueous, semiaqueous, and no-clean] cleaning - inspection - repair - total quality management - statistical process control - thermal management - electrical testing - reliability - and technical management
This book offers contributions from a wide array of experts who address areas covering the most advanced research and solutions technology in the field today. With this volume, you will develop a practical understanding of the economic, design, material, process, equipment, quality, testing, reliability, and management issues of FPT.
1. A Brief Introduction to Fine Pitch Surface Mount Technology
2. Fine Pitch Packaging for Surface Mount
3. Solderability of Fine Pitch Surface Mount Components
4. Substrate Materials and Design for Fine Pitch Technology
5. Fine Pitch Soldering and Solder Paste
6. Screen and Stencil Printing Technology for Fine-Pitch Assembly
7. Pick and Place Technology for Fine Pitch Assembly
8. Estimation of Solder Volume
9. Vapor Phase Solder Reflow for Fine Pitch Assembly
10. Convection/Infrared and Convection Dominant Reflow Soldering of Fine Pitch SMT Devices
Etc.